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Midas Immersion Cooling Collaborates with Dr. Dalir’s Lab at the University of Florida’s Semiconductor Institute to Revolutionize Immersion Cooling Technology

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In an exciting new partnership, Midas Immersion Cooling (Midas), a leading innovator in immersion cooling solutions, has teamed up with the University of Florida’s Semiconductor Institute (FSI) to push the boundaries of semiconductor and immersion cooling technology. This collaboration is set to transform the landscape of semiconductor cooling through cutting-edge research and development. Midas has […]

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Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate HW Security Issues

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The semiconductor industry is evolving beyond traditional cost-cutting and size reduction methods. Designers are exploring Heterogeneous Integration (HI) to enhance cost-effectiveness and functionality through advanced packaging.

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