Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate HW Security Issues

The semiconductor industry is evolving beyond traditional cost-cutting and size reduction methods. Designers are exploring Heterogeneous Integration (HI) to enhance cost-effectiveness and functionality through advanced packaging. However, HI introduces design and security challenges. To support HI and secure the supply chain, the US government is bringing semiconductor manufacturing onshore, but it’s crucial to strengthen domestic advanced packaging capabilities. Our research identifies potential issues in the US-based advanced packaging supply chain. Find the┬átechnical paper here or read the article by SemiEngineering here.