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SEMINARS
24.06.14
ADVANCED PACKAGING TECHNOLOGIES & SEMICONDUCTOR EDUCATION
Dale Miller, the Florida Vice President and General Manager at SkyWater Technology Foundry. He will highlight advanced packaging technologies, including Interposer, Hybrid Bonding, Fan-Out Wafer Level Packaging, and Prototype Assembly, developed at SkyWater’s Florida location.
Dr. Gloria Kim, an Assistant Professor in the Dept. of Engineering Education at the University of Florida. Dr. Kim will provide an overview of her extramurally-funded work at the intersection of chips, education, and global partnerships.
24.05.24
EXTREME SENSING & FSI VISION
UF Professor Mark Sheplak, will present a project funded by the DARPA High Operational Temperature Sensors (HOTS) program. With a focus on designing dynamic pressure sensors capable of withstanding temperatures exceeding 800 °C (1472 °F), this $6.6M initiative promises to unlock new frontiers.
FSI Acting Director Dr. David Arnold will provide an overview, outlook, and vision for the Florida Semiconductor Institute.