Undergraduate Coursework
The fabrication of microelectronics is the process of creating the intricate and tiny components that power modern technology, such as transistors and sensors, within semiconductor-based systems. This field combines cutting-edge techniques like photolithography, thin-film deposition, and plasma-based etching to produce microscale and nanoscale electronic devices and systems. Careers in the fabrication of microelectronics are at the forefront of innovation, enabling breakthroughs in advanced consumer products, high-performance computation, and artificial intelligence hardware.
Primary:
EEE 4331 – Microelectronic Fabrication Technologies (3 credits)
EMA 4414L – Electronic Materials Lab (1 credit)
EMA 4614 – Electronic Materials Processing (3 credits)
EEL 4930 – Fabrication of Micro/Nano Systems (3 credits)
ECH 4905 – Semiconductor Device Fabrication Principles for Chemical Engineers (3 credit)
Secondary:
EEE 4329 – Future of Microelectronics (3 credits)
EEL 4930 – Introduction to Quantum Devices and Quantum Engineering (3 credits)
Supportive:
EEL 3008 – Physics of Electrical Engineering (3 credits)
EEE 3396 – Solid-State Electronic Devices (3 credits)
EEL 3111 – Circuits 1 (4 credits)
EEL 3003 – Elements of Electrical Engineering (3 credits)
The physics of microelectronics explores the fundamental principles governing the behavior of electrons and quantum effects within microscale and nanoscale semiconductors devices. This topic covers concepts like carrier transport, energy band structures, and tunneling, which are critical for advancing technologies like transistors and other semiconductor devices. Students drawn to theoretical and experimental physics can pursue careers in R&D, working to push the limits of solid-state devices and revolutionize future computing systems.
Primary:
EEE 3396 – Solid-State Electronic Devices (3 credits)
EMA 3413 – Electronic Properties of Materials (3 credits)
Secondary:
EEE 4414 – Modern Memory Device Technologies (3 credits)
EEE 4329 – Future of Microelectronics (3 credits)
EEE 4420 – Introduction to Nanodevices (3 credits)
EEL 4930 – Introduction to Quantum Devices and Quantum Engineering (3 credits)
EEE 4423 – Introduction to Quantum Computing (3 credits)
EEE 4222 – Resonant MEMS (3 credits)
EEL 4248 – Fundamentals of RF and Power Electronic Devices (3 credits)
EEL 4930 – Micro/Nano Machined Metamaterials (3 credits)
Supportive:
EEL 3003 – Elements of Electrical Engineering (3 credits)
EEL 3008 – Physics of Electrical Engineering (3 credits)
EEL 3111 – Circuits 1 (4 credits)
Photonic microelectronics blends the power of light with electronic circuits to enable faster data transmission and energy-efficient devices. By integrating photonic components, such as lasers and waveguides, with microchips, engineers are advancing fields like fiber-optic communication, quantum computing, and artificial intelligence. This area offers exciting opportunities for careers in telecommunications, advanced manufacturing, and next-generation computing.
Primary:
EEL 4458 – Fundamentals of Photonics (3 credits)
Secondary:
EEL 4446 – Laser Theory and Design (3 credits)
Supportive:
EEL 3003 – Elements of Electrical Engineering (3 credits)
EEL 3008 – Physics of Electrical Engineering (3 credits)
The design of microelectronic circuits focuses on creating functional layouts of transistors and other circuits components to achieve desired electrical performance advanced analog, digital, mixed-signal, and RF circuits. Students will acquire expertise in circuit simulation, optimization, and testing, to ensure successful, efficient, and reliable designs. Students interested in creatively solving quantitative, multi-factor, and constraint-driven problems can build careers designing advanced microelectronic circuits for consumer, automotive, medical, and military electronics at chip-design firms.
Primary:
EEE 4306 – Electronic Circuits 2 (3 credits)
Secondary:
EEL 4930 – Introduction to RF Circuits (3 credits)
EEL 4242 – Power Electronic Circuits (3 credits)
EEE 4373 – Radio Frequency Integrated Circuits 1 (3 credits)
EEE 4310 – VLSI Circuits and Technology (3 credits)
Supportive:
EEL 3003 – Elements of Electrical Engineering (3 credits)
EEL 3008 – Physics of Electrical Engineering (3 credits)
EEL 3111 – Circuits 1 (4 credits)
EEL 3112 – Circuits 2 (3 credits)
EEE 3308 – Electronic Circuits 1 (4 credits)
The design of Very-Large-Scale Integration (VLSI) and Ultra-Large-Scale Integration (ULSI) systems involves developing and integrating billions of transistors into compact and high-performing microchips. This field addresses challenges in power consumption, heat dissipation, and scalability, making it critical for producing processors, GPUs, and memory devices. Careers in VLSI and ULSI design are at the forefront of technological innovation, shaping the future of AI, IoT, and autonomous systems.
Primary:
EEE 4310 – VLSI Circuits and Technology (3 credits)
Secondary:
EEL 4713 – Digital Computer Architecture (4 credits)
EEL 4712 – Digital Design (4 credits)
EEL 3744 – Microprocessor Applications (4 credits)
EEL 4745 – Microprocessor Applications 2 (4 credits)
EEL 4720 – Reconfigurable Computing (3 credits)
Supportive:
EEL 3003 – Elements of Electrical Engineering (3 credits)
EEL 3008 – Physics of Electrical Engineering (3 credits)
EEL 3111 – Circuits 1 (4 credits)
EEE 3308 – Electronic Circuits 1 (4 credits)
EEL 3701C – Digital Logic and Computer Systems (4 credits)
Packaging microelectronic systems is the crucial step of interconnecting, enclosing, and protecting semiconductor devices while ensuring electrical and thermal connections. This field addresses challenges such as miniaturization, heat dissipation, and reliability, which are vital for applications involving consumer, aerospace, military, and biomedical electronics. Students interested in multiphysics design (electrical, thermal, mechanical, etc.), materials science, and engineering can thrive in careers improving the robustness and performance of packaged electronic devices.
Secondary:
EEL 4930 – Micro/Nano Machined Metamaterials (3 credits)
EEL 4461 – Antenna Systems (3 credits)
EEL 4930 – Introduction to Semiconductor Packaging (3 credits)
Hardware security and assurance focus on protecting microelectronic systems against vulnerabilities such as counterfeiting, tampering, and cyberattacks, as well as ensuring their reliability and functionality. This field combines expertise in cryptographic hardware, secure design practices, and testing methodologies to safeguard critical systems in defense, finance, and healthcare. Students interested in cybersecurity and electronics can pursue impactful careers addressing global challenges in secure technology deployment and infrastructure protection.
Primary:
EEE 4714 – Introduction to Hardware Security and Trust (3 credits)
Secondary:
EEE 4701 – Automated Hardware/Software Verification (3 credits)
EEL 4853 – Cross Layered System Security (3 credits)
EEE 4740 – Physical Attacks and Inspection of Electronics (3 credits)
Supportive:
EEL 3003 – Elements of Electrical Engineering (3 credits)
EEL 3701C – Digital Logic and Computer Systems (4 credits)
EEL 3111 – Circuits 1 (4 credits)
Materials and metrology for microelectronics focuses on the design, processing, and precise characterization of materials critical for semiconductor and microelectronic devices. This field includes studying compound semiconductors, functional material properties, and diffusion kinetics, while utilizing advanced techniques like X-ray diffraction, electron microscopy, and thin-film metrology to ensure material performance and reliability. Graduate students in this area gain expertise in electronic materials processing, characterization methods, and device integration, preparing for impactful careers in semiconductor manufacturing, materials research, and quality assurance within the microelectronics industry.
Primary:
EMA 3413 – Electronic Properties of Materials (3 credits)
EMA 3513C – Analysis of the Structure of Materials (3 credits)
EMA 4414L – Electronic Materials Lab (1 credit)
EMA 4614 – Production of Electronic Materials (3 credits)
EMA 4615 – Compound Semiconductors Materials (3 credits)
EMA 4714 – Materials Selection and Failure Analysis (3 credits)
Chemical processes for microelectronics focus on the design and optimization of technologies essential for semiconductor device fabrication, such as etching, deposition/growth, photolithography, doping, and planarization. This field combines principles of kinetics and reactor design, process control and safety, heat and mass transfer, and electron transport phenomena to develop precise, reliable, and efficient manufacturing techniques for nanoscale devices. Undergraduate students in this area gain expertise in process design, material interactions, and experimental analysis, preparing them for impactful careers in semiconductor fabrication, process engineering, and advanced materials research within the microelectronics industry.
Primary:
ECH 4404 – Separation and Mass Transfer Operations Laboratory (3 credits)
ECH 4824 – Materials of Chemical Engineering (3 credits)
Secondary:
ECH 4905 – Electron Transport Phenomena in Semiconductors (3 credits)
ECH 4905 – Semiconductor Device Fabrication (3 credits)
EMA 4414L – Electronic Materials Lab (1 credit)
EMA 4614 – Production of Electronic Materials (3 credits)
EMA 4615 – Compound Semiconductor Materials (3 credits)
EEE 4331 – Microelectronic Fabrication Technologies (3 credits)
EEL 4930 – Fabrication of Micro/Nano Systems (3 credits)
Graduate Coursework
The fabrication of microelectronics is the process of creating the intricate and tiny components that power modern technology, such as transistors and sensors, within semiconductor-based systems. This field combines cutting-edge techniques like photolithography, thin-film deposition, and plasma-based etching to produce microscale and nanoscale electronic devices and systems. Careers in the fabrication of microelectronics are at the forefront of innovation, enabling breakthroughs in advanced consumer products, high-performance computation, and artificial intelligence hardware.
Primary:
EEE 5405 – Microelectronic Fabrication Technologies (3 credits)
Secondary:
EEL 5934 – Fabrication of Micro/Nano Systems (3 credits)
EEE 5400 – Future of Microelectronics (3 credits)
EEL 5934 – Introduction to Quantum Devices and Quantum Engineering (3 credits)
EEL 5354 – Semiconductor Device Fabrication Laboratory (3 credits)
Supportive:
EEE 3396 – Solid-State Electronic Devices (3 credits)
The physics of microelectronics explores the fundamental principles governing the behavior of electrons and quantum effects within microscale and nanoscale semiconductors devices. This topic covers concepts like carrier transport, energy band structures, and tunneling, which are critical for advancing technologies like transistors and other semiconductor devices. Students drawn to theoretical and experimental physics can pursue careers in R&D, working to push the limits of solid-state devices and revolutionize future computing systems.
Primary:
EEE 5415 – Modern Memory Device Technologies (3 credits)
EMA 6114 – Properties of Functional Materials (3 credits)
EEL 5249 – Fundamentals of RF and Power Electronic Devices (3 credits)
Secondary:
EEL 5225 – Principles of Micro-Electro-Mechanical Transducers (3 credits)
EEE 5225 – Resonant MEMS (3 credits)
EEE 5400 – Future of Microelectronics Technology (3 credits)
EEL 5934 – Introduction to Quantum Devices and Quantum Engineering (3 credits)
EEE 5590 – Introduction to Quantum Computing (3 credits)
EEE 5467 – Micro/Nano Machined Metamaterials (3 credits)
EEE 6431 – Carbon Nanotubes (3 credits)
EMA 6136 – Diffusion, Kinetics, and Transport Phenomena (3 credits)
ECH 6225 – Electron Transport Phenomena in Semiconductors (3 credits)
Supportive:
EEE 3396 – Solid-State Electronic Devices (3 credits)
EMA 3413 – Electronic Properties of Materials
Photonic microelectronics blends the power of light with electronic circuits to enable faster data transmission and energy-efficient devices. By integrating photonic components, such as lasers and waveguides, with microchips, engineers are advancing fields like fiber-optic communication, quantum computing, and artificial intelligence. This area offers exciting opportunities for careers in telecommunications, advanced manufacturing, and next-generation computing.
Primary:
EEL 5441 – Fundamentals of Photonics (3 credits)
Secondary:
EEL 5447 – Laser Theory and Design (3 credits)
The design of microelectronic circuits focuses on creating functional layouts of transistors and other circuits components to achieve desired electrical performance advanced analog, digital, mixed-signal, and RF circuits. Students will acquire expertise in circuit simulation, optimization, and testing, to ensure successful, efficient, and reliable designs. Students interested in creatively solving quantitative, multi-factor, and constraint-driven problems can build careers designing advanced microelectronic circuits for consumer, automotive, medical, and military electronics at chip-design firms.
Primary:
EEE 5320 – Analog IC Design I (3 credits)
Secondary:
EEE 5317 – Introduction to Power Electronics (3 credits)
EEE 5374 – Radio Frequency Integrated Circuits 1 (3 credits)
EEE 5364 – Fundamentals of Data Converters (3 credits)
EEL 5934 – Introduction to RF Circuits (3 credits)
EEL 6246 – Power Electronics II (3 credits)
EEE 6321 – Analog IC Design II (3 credits)
Supportive:
EEE 3308C – Electronic Circuits 1 (3 credits)
EEE 4306 – Electronic Circuits 2 (3 credits)
The design of Very-Large-Scale Integration (VLSI) and Ultra-Large-Scale Integration (ULSI) systems involves developing and integrating billions of transistors into compact and high-performing microchips. This field addresses challenges in power consumption, heat dissipation, and scalability, making it critical for producing processors, GPUs, and memory devices. Careers in VLSI and ULSI design are at the forefront of technological innovation, shaping the future of AI, IoT, and autonomous systems.
Primary:
EEE 5322 – VLSI Circuits and Technology 1 (3 credits)
Secondary:
EEE 6323 – VLSI Circuits and Technology 2 (3 credits)
EEL 5749 – IoT Design (3 credits)
EEL 5739 – IoT Security and Privacy (3 credits)
EEL 5934 – System-on-Chip Design (3 credits)
EEL 6935 – Reconfigurable Computing 2 (3 credits)
Packaging microelectronic systems is the crucial step of interconnecting, enclosing, and protecting semiconductor devices while ensuring electrical and thermal connections. This field addresses challenges such as miniaturization, heat dissipation, and reliability, which are vital for applications involving consumer, aerospace, military, and biomedical electronics. Students interested in multiphysics design (electrical, thermal, mechanical, etc.), materials science, and engineering can thrive in careers improving the robustness and performance of packaged electronic devices.
Secondary:
EEE 5467 – Micro/Nano Machined Metamaterials (3 credits)
EEL 5934 – Introduction to Semiconductor Packaging (3 credits)
Hardware security and assurance focus on protecting microelectronic systems against vulnerabilities such as counterfeiting, tampering, and cyberattacks, as well as ensuring their reliability and functionality. This field combines expertise in cryptographic hardware, secure design practices, and testing methodologies to safeguard critical systems in defense, finance, and healthcare. Students interested in cybersecurity and electronics can pursue impactful careers addressing global challenges in secure technology deployment and infrastructure protection.
Primary:
EEE 5716 – Introduction to Hardware Security and Trust (3 credits)
Secondary:
EEE 6742 – Advanced Hardware Security and Trust (3 credits)
EEE 5702 – Automated Hardware/Software Verification (3 credits)
EEL 6935 – CAD for Hardware Security Validation (3 credits)
EEE 6744 – Hands-On Hardware Security (3 credits)
EEE 5480 – Physical Attacks and Inspection of Electronics (3 credits)
Materials and metrology for microelectronics focuses on the design, processing, and precise characterization of materials critical for semiconductor and microelectronic devices. This field includes studying compound semiconductors, functional material properties, and diffusion kinetics, while utilizing advanced techniques like X-ray diffraction, electron microscopy, and thin-film metrology to ensure material performance and reliability. Graduate students in this area gain expertise in electronic materials processing, characterization methods, and device integration, preparing for impactful careers in semiconductor manufacturing, materials research, and quality assurance within the microelectronics industry.
Primary:
EMA 6001 – Properties of Materials – A Survey (3 credits)
EMA 6114 – Properties of Functional Materials (3 credits)
EMA 6412 – Synthesis of Characterization of Electronic Materials (3 credits)
EMA 6136 – Diffusion, Kinetics, and Transport Phenomena (3 credits)
EMA 6507 – Scanning Electron Microscopy and Microanalysis (3 credits)
EMA 6516 – X-Ray Methods for Materials Characterization (3 credits)
EMA 6518 – Transmission Electron Microscopy (3 credits)
EMA 6616 – Advanced Microelectronic Materials Processing (3 credits)
Supportive:
EMA 3413 – Electronic Properties of Materials (3 credits)
EMA 3513C – Analysis of the Structure of Materials (3 credits)
EMA 4414L – Electronic Materials Lab (1 credit)
EMA 4614 – Production of Electronic Materials
EMA 4615 – Compound Semiconductor Materials (3 credits)
EMA 4714 – Materials Selection and Failure Analysis (3 credits)
Chemical processes for microelectronics focus on the design and optimization of technologies essential for semiconductor device fabrication, such as etching, deposition/growth, photolithography, doping, and planarization. This field combines principles of kinetics and reactor design, process control and safety, heat and mass transfer, and electron transport phenomena to develop precise, reliable, and efficient manufacturing techniques for nanoscale devices. Graduate students in this area gain expertise in process design, material interactions, and experimental analysis, preparing them for impactful careers in semiconductor fabrication, process engineering, and advanced materials research within the microelectronics industry.
Primary:
ECH 6937 – Advanced Chem and Bio Laboratory (3 credits)
ECH 6843 – Design and Analysis of Chemical Engineering Experiments (3 credits)
Secondary:
ECH 6836 – Semiconductor Device Fabrication (3 credits)
ECH 6937 – Electron Transport Phenomena in Semiconductors (3 credits)
EMA 6412 – Synthesis of Characterization of Electronic Materials (3 credits)
EMA 6616 – Advanced Electronic Materials Processing (3 credits)
EMA 6507 – Scanning Electron Microscopy and Microanalysis (3 credits)
EMA 6516 – X-Ray Methods for Materials Characterization (3 credits)
EMA 6518 – Transmission Electron Microscopy (3 credits)
EEE 5405 – Microelectronic Fabrication Technologies (3 credits)
EEL 5934 – Fabrication of Micro/Nano Systems (3 credits)
Resources
This course is a self-funded “off book” course. The tuition amount is different from the tuition rates published by the UF Bursar’s Office. If you are interested in registering please complete the form below.
Semiconductor Career Readiness Organization (SCRO) is a student-run interdisciplinary club that is designed to expand the knowledge of students in the semiconductor industry. Students are introduced to semiconductor topics through lecture series, and can engage in a hands-on fabrication workshop held every summer on campus.
This seminar series serves as a platform for interdisciplinary discussions and knowledge exchange in the dynamic field of semiconductor technology. The seminar series occurs every 3 weeks on Friday, from 11:45 a.m. to 1:00 p.m., in Larsen Hall room 234.
FSI recently released a strategic semiconductor workforce report, titled ”Analysis of Pre-Baccalaureate Workforce for Florida’s Semiconductor Industry.” This report analyzed and quantified emergent semiconductor-related job demand through 2030 and identified clear strengths in Florida’s workforce training pipelines. This report is one element of a comprehensive effort to support the semiconductor industry in the state. Florida currently ranks fifth nationally for the number of semiconductor manufacturing employees, third nationally for number of semiconductor establishments, and is well positioned for sustainable growth.