Taste of Tech Seminar: Metaconductors for Next Generation Electronics and Advanced Packaging | Advanced Packaging with Northrop Grumman + Meet and Greet Networking Hour
Time and Date
10/20/2025
11:45 AM – 2:00 PM (EST)
Agenda
Lunch: 11:45 – 12:00 Talk 1: 12:00 – 12:20 Talk 2: 12:20 – 12:40 Extended Networking with Northrop Grumman: 1:00 – 2:00
Talk 1: Metaconductors for Next Generation Electronics and Advanced Packaging
Presentation Overview: The presentation will review the concept of superlattice metaconductors consisting of non-ferromagnetic (Cu, Al, or Au) and ferromagnetic metals (Ni, Co, Fe, NiFe), followed by metaconductor-based component examples such as meta-interconnects for next generation chiplets, glass substrate integrated passive devices (IPD), and metaconductor based array antennas in packaging, highlighting their superior performance to the solid copper counterpart at millimeter-wave frequencies.
Dr. YK Yoon
About the Speaker
YK Yoon is currently a Professor in the Department of Electrical and Computer Engineering at the University of Florida, Gainesville, FL. His current research interests include three dimensional (3-D) micromachining and nano fabrication; design and implementation of metamaterial for radio frequency (RF) and microwave applications; micromachined millimeter wave and terahertz antennas and waveguides; bio/microfluidic systems for the lab-on-a-chip applications; wireless telemetry systems for biomedical applications; and ferroelectric material development for high density memory devices and/or tunable RF devices.
He received his BS and MS degrees in electrical engineering from Seoul National University in Korea. He also earned an MSEE degree from the New Jersey Institute of Technology, Newark, NJ in 1999 and the Ph.D. degree in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA in 2004. He held a postdoctoral position in the Microelectronics Research Center of Georgia Institute of Technology from 2004 to 2006. In 2006, he joined the faculty of the University at Buffalo, the State University of New York as an Assistant Professor in the Department of Electrical Engineering, where he directed the Multidisciplinary nano and Microsystems (MnM) laboratory until 2010. He received the NSF Early Career Development Award (CAREER) in 2008 and the Young Investigator Award from the University at Buffalo in 2009. He has more than 90 peer reviewed publications. He is a member of IEEE society. He actively participates in multiple technical conferences including Microelectromechanical systems (MEMS), Transducers, Hilton Head, micro total analysis systems (µTAS), American Vacuum Society (AVS), International Microwave Symposium (IMS) and Antenna Propagation Symposium (APS).
Talk 2: Advanced Packaging with Northrop Grumman + Meet and Greet Networking Hour
Presentation Overview: Northrop Grumman has been designing, manufacturing, and testing semiconductor solutions for decades and as the technology areas evolve, we are blazing a trail in ‘Advanced Packaging.’ The packaging of microelectronics allows more functionality for the end system to be applied using a smaller ‘package’ or stack of chips. Advanced Packaging is the future of defense and commercial industries and will greatly reduce the overall size, weight, and power consumption used for future systems and platforms.
David I. Shahin
About the Speaker
Dr. David I. Shahin leads the Northrop Grumman Microelectronics Center’s Advanced Packaging Operating Unit. He is responsible for leading the Center’s programs & investments to develop, mature, and deploy Advanced Packaging technologies in the service of critical defense and onshore needs. Since 2019, he has managed Northrop Grumman’s capital investments related to Advanced Packaging, including establishing and operationalizing the 100-300mm wafer bumping line in Apopka, FL and advanced assembly capabilities in Baltimore, MD.
Dr. Shahin previously served as Northrop Grumman’s principal investigator and technical lead for multiple Department of Defense programs, focused on advanced packaging.
He holds a Doctorate in Materials Science & Engineering from the University of Maryland, College Park where he focused on wide and ultra-wide bandgap semiconductor fabrication development, and Bachelor’s/Master’s Degrees in Ceramic Engineering from the Missouri University of Science & Technology.
Northrop Grumman is a leading global aerospace and defense technology company. Our pioneering solutions equip our customers with the capabilities they need to connect and protect the world, and push the boundaries of human exploration across the universe. Driven by a shared purpose to solve our customers’ toughest problems, our employees define possible every day.
| Thank you to our semester sponsor, Rohde & Schwarz, USA! Thanks to their generous support, this series will continue to bring together industry leaders, innovators, and tech enthusiasts for an unmatched experience exploring the latest trends and breakthroughs in the semiconductor industry. |
