Samuel Lim

Talk Title

Silicon Capacitors for the Future of High-Performance & High-Reliability Systems

Description of Talk

This talk addresses power delivery as a system level limiter for next generation AI and explains why silicon capacitors outperform conventional MLCCs under real operating conditions. We present ELSPES deep trench silicon capacitor results—ultra low ESL (<1 pH), wide low impedance bandwidth (up to ~GHz), voltage/temperature stability, and proven reliability—together with advanced packaging integration examples.

Biography

Samuel Lim is Director of New Business Development at ELSPES Inc., leading initiatives in advanced capacitor technologies and R&D collaboration for next‑generation packaging. He previously worked in process integration at Samsung Semiconductor and currently serves as Technical Director of the Korean Microelectronics & Packaging Society. He frequently speaks on deep trench capacitors and advanced packaging innovations.