Signature Research Programs
Florida Semiconductor Engine
The Florida Semiconductor Engine, led by the International Consortium for Advanced Manufacturing Research (ICAMR, Inc.) and doing business as BRIDG, aims to play a critical role in supporting the nation’s capability for semiconductor advanced packaging design and manufacturing, rooting a vital industry on American shores and securing national defense.
Microelectronics Commons
Funded by the CHIPS and Science Act, the Microelectronics Commons program is a network of regional technology Hubs acting on a shared mission: to expand the nation’s global leadership in microelectronics. The Microelectronics Commons program is accelerating domestic prototyping and growing a pipeline of U.S.-based semiconductor talent.
SMART USA Institute
Semiconductor Manufacturing and Advanced Research with Twins USA, or SMART USA, Institute will focus on efforts to more rapidly develop, validate, and use digital twins to improve domestic semiconductor design, manufacturing, advanced packaging, assembly, and test processes.
National Advanced Packaging Manufacturing Program
The CHIPS National Advanced Packaging Manufacturing Program will make approximately $3 billion in investments to develop critical and relevant innovations for advanced packaging technologies and accelerate their scaled transition to U.S. manufacturing entities. These investments will include research programs for core technologies that can be scaled to high-volume manufacturing, an advanced packaging piloting facility to support this scaling, resources to support the expansion of advanced packaging solutions, and workforce development.
Research Infrastructure
Florida Semiconductor Institute Lab
Located on the first floor of UF’s latest building, Malachowsky Hall Data Science and Information Technology, the FSI lab offers 4,000 s.f. of shared-use dry-lab space. The lab features state-of-the-art electronic, photonic, and advanced imaging equipment in a hands-on environment for students and collaborators.
Learn MoreInterdisciplinary Microsystems Group
IMG research labs span over 9,000 s.f. of mixed-use laboratories across multiple campus buildings to support design, fabrication, characterization, and deployment of micro and nanotechnologies. The 12-faculty-member IMG group employs a ‘house’ model, where some general labs are shared by many, while more specialized labs may only be used by one or two individual PI’s. The lab spaces are divided by function rather than faculty name, such as Microfab, Lithography, Packaging, Prototyping, Laser Machining, Electronic Test, Mechanical Test, Optical Test, Magnetic Test, Microfluidics, and more.
Learn MoreSCAN LAB
The SCAN Lab at UF’s FICS Research is a 2,500 sq. ft. facility equipped with $7M+ in advanced tools for electronics security research. It supports cutting-edge work in micro/nano imaging, IC testing, and counterfeit detection, while also offering hands-on training and access to Florida businesses through UF’s FLEXStation program.
Learn MoreNanoscale Research Facility (NRF)
The Nanoscale Research Facility (NRF) provides a unique research and training platform that supports cross-disciplinary efforts to use micro/nanoscale characterization and fabrication, 3D imaging, heterogeneous integration, and packaging technologies at the intersection of science, engineering, and society to foster invention, sustainable economic growth, and national resilience. The 20,000+ s.f. facility features a 7,300 s.f. Class 100/1000 micro/nanofabrication cleanroom, along with state-of-the art materials analysis, advanced imaging, and tomography capabilities.
Learn MoreFeatured Research Areas
5G/6G RF Modules
Seamless connectivity and robust communication networks are essential for future technologies. This research is focused on designing high-performance RF modules that support unprecedented data rates, low latency, and enhanced signal integrity are crucial for next-generation telecommunications, autonomous vehicles, and advanced radar applications.
Ultrawide Bandgap Materials & Devices
Research on ultrawide bandgap materials and devices enables high-power transistors and converters, enhancing the efficiency and performance of power electronics. These innovations are critical for applications in energy-efficient power grids, electric vehicles, and robust industrial machinery, enabling superior power handling and energy transfer in demanding environments.
Photonic Integrated Circuits
Harnessing light-based technologies is crucial to developing compact, high-speed circuits that significantly enhance data processing and computational efficiency. Applications including advanced AI systems, high-performance computing, and next-generation analog devices, driving breakthroughs in speed and efficiency for data-intensive tasks.
Assured Physical Microsystems
Secure and assured microsystems require developing compact, resilient structures that enhance data security and processing capabilities directly at the data source or across the electronics supply chain. These systems are critical for applications requiring secure and efficient edge computing, such as IoT devices, smart sensors, and autonomous systems, ensuring robust performance and data integrity in real-time environments.
Quantum Science & Engineering
Advancing research in unparalleled sensing and computing technologies focuses on leveraging quantum mechanics to develop ultra-sensitive sensors and revolutionary computing systems. These innovations promise to deliver unprecedented accuracy in measurements and vastly superior computational power, with applications spanning quantum computing, precision measurement, and advanced data analysis.
Partner with FSI to Shape the Future of Semiconductors
Join the Florida Semiconductor Institute in driving innovation and advancing semiconductor research. With cutting-edge facilities and a collaborative ecosystem, we’re ready to tackle challenges and create impactful solutions together.