The CHIPS Metrology Program, one of the CHIPS for America Research and Development programs, is excited to bring a special half-day workshop to the IEEE PAINE 2024 conference on the afternoon of November 13.
Join us for a Special Session on CHIPS Metrology Projects Related to Microelectronics Advanced Packaging, Inspection, and Reliability
This session will feature short presentations from a sample of the more than 40 funded CHIPS Metrology research projects at the National Institute of Standards and Technology (NIST). In these presentations, you will learn more about these select funded research projects and the role that metrology plays in advanced packaging, as well as assurance that a circuit or system can be expected to preserve the confidentiality, integrity, and availability of the information being processed, stored, or transmitted by the system across the full range of threats and failure mechanisms. Participants will be able to participate in a Q&A session and will also have the opportunity to learn more about the CHIPS Metrology Community. The Community will facilitate data and knowledge sharing across initiatives within the CHIPS Metrology seven Grand Challenges, bridging the cultural and knowledge gaps between ‘fab’ and ‘lab’ and help stakeholders inform industry standards that are critical for enhancing U.S. economic and national security competitiveness.
Learn more about the IEEE PAINE 2024 conference and register here.
The IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) 2024, is chaired by Dr. Navid Asadi, Deputy Director for R&D, at the Florida Semiconductor Institute.
