Charles Woychik

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VP Business Development, NHanced Semiconductors, Inc.

Talk Title

The Evolution of Advanced Packaging

Description of Talk

Advanced packaging has transformed semiconductor integration, with hybrid bonding emerging as a key enabler for sub-micron precision and enhanced interconnect density in 3D stacking. This technique directly fuses metal and dielectric layers between dies, improving electrical performance, reducing latency, and supporting high-bandwidth applications. As industries adopt hybrid bonding alongside innovations like chiplet architectures and fan-out packaging, it plays a pivotal role in advancing performance, scalability, and power efficiency for next-generation electronics.

Biography

Charles Woychik is currently the VP of Business Development at NHanced Semiconductors, Inc.  Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology.  Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research, and IBM. He holds a Doctorate and Masters of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor’s of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 123 issued US patents to his credit.