Alan Huffman
Chief Engineer/Technologist, L3Harris
Talk Title
Developing a Domestic Advanced Packaging Ecosystem
Description of Talk
The CHIPS Act has helped to catalyze tremendous growth plans for semiconductor manufacturing in the U.S. While the majority of this funding has been focused on foundry device fabrication capabilities, both advanced and legacy nodes, there have been some packaging-centric awards. In addition to this investment, other capabilities to support leading edge packaging and HI technologies that would provide access to both commercial and A&D customers are being developed on a number of fronts. This presentation provides an overview of some of the major initiatives in progress to establish domestic advanced packaging and integration capabilities.
Biography
Alan Huffman is a Chief Engineer and Sr. Scientist in the Microelectronics Division at L3Harris, supporting 3DHI and advanced packaging programs. Over the course of over 30 years in the advanced packaging industry, he has held previous positions at SkyWater (Sr. Director), Micross AIT (Director of Engineering), RTI International (Sr. Reseach Engineer and Program Manager), and MCNC Research & Development Institute (Member of Technical Staff). He received the B.S degree in physics from The University of North Carolina at Chapel Hill in 1994. His technical focus has been wafer level packaging, heterogeneous integration, and advanced interconnect technologies throughout his career and has authored or co-authored numerous papers and presentations in these areas. Alan is an IEEE Senior Member and highly active within the IEEE Electronics Packaging Society, currently serving on the Board of Governors as Membership VP. He has served on the ECTC executive and technical committees for 20 years and was General Chair for the 2016 ECTC.