On Thursday, October 24th, the Florida Semiconductor Institute (FSI), the Midwest Microelectronics Consortium (MMEC), and the NSF Central Florida Semiconductor Innovation Engine (CFSIE) formalized their partnership with a Memorandum of Understanding (MoU) signing ceremony. This MoU is strategically aimed at reestablishing global leadership in semiconductor innovation and manufacturing capabilities.
The MMEC is a Microelectronics Commons designated hub under the CHIPS and Science Act that promotes a “No-Excuse” innovation roadmap, providing access to critical infrastructure and technology advancement project opportunities to member organizations. The foundational goal of these efforts is the acceleration of Lab-to-Fab-to-Mission and Market providing long-term solutions aimed at reestablishing domestic global leadership in semiconductor innovation and manufacturing capabilities. The MMEC was founded in the Midwest but has expanded to include the Mid-Atlantic and now the Southeast. The MoU between MMEC, FSI and CFSIE outlines a partnership that will bolster technical capabilities, provide access and utilization of differentiating digital and physical infrastructure, and will jointly enhance capability and capacity across organizations to unify regional stakeholders from industry, academia, and government. It will also establish dedicated working groups focused on advanced packaging to include heterogeneous integration and high-density interconnects, critical for the next generation of microelectronics advancement. Additionally, the partnership seeks to enhance semiconductor education, workforce development, and training, while expanding MMEC’s efforts of scaling up semiconductor initiatives and stakeholder alignment across the Southeast region.
Following the signing ceremony, leaders toured the FSI Lab, the UF Nanoscale Research Facility, the UF Interdisciplinary Microsystems Group, and the SeCurity and AssuraNce (SCAN) Lab. The day concluded with a brainstorming session involving key stakeholders to discuss the next steps for the partnership.
By connecting the Midwest and Southern semiconductor regions of the U.S., this partnership promises to unlock new avenues for collaboration and innovation, generating opportunities that can only arise from the combined strengths of these three organizations. The partners will work together to synergize R&D efforts, expand regional engagement, build economies of scale, and avoid duplication in the growing tapestry of federal, state, and regional initiatives spurred by the CHIPS Act.
David P. Arnold, Acting Director, Florida Semiconductor Institute, University of Florida.
“The Southeast is eager to work with our Midwest and Mid-Atlantic partners. Our alliance will increase coordination and impact in this whole-of-nation effort.”
Jackie Janning-Lask, Chief Executive Officer, Midwest Microelectronics Consortium
“Almost every facet of our modern economy and infrastructure relies on chips,” said MMEC CEO Jackie Janning- Lask. “If we truly want to position the US as the center of semiconductor development and innovation, we have to bolster efforts to create inventive solutions. This exciting new partnership will expand the capabilities of our microelectronics development efforts to fulfill the goals of creating a balanced and resilient semiconductor supply chain to address the needs of the warfighter for the benefit of national security.”
Matt Casto, Chief Technology Officer, Midwest Microelectronics Consortium
“The MMEC is proud to be part of a new partnership formed with FSI and NSF CFSIE,” stated Dr. Matt Casto, MMEC CTO. “This partnership is exciting not only because it will expand the network of the MMEC, but also because it will provide critical capabilities, accelerate domestic microelectronics production, and grow a pipeline of US-based semiconductor workforce.”
Tawny H. Olore, Chief Executive Officer, NSF Engines Central Florida Semiconductor Innovation Engine
“This partnership leverages the existing foundation laid by NeoCity partners, enabling the NSF CFSIE to accelerate its involvement with MECommons through key initiatives in research and development, translation, and workforce development,” stated Tawny Olore, P.E., CEO of the NSF Engines CFSIE. “Integrating the Advanced Packaging Center into these activities further strengthens the collaboration, positioning us to drive impactful advancements in technology and workforce readiness.”
Central Florida Semiconductor Innovation Engine, Jackie Janning-Lask, Chief Executive Officer, Midwest Microelectronics Consortium, Forrest J. Masters, Interim Dean, Herbert Wertheim College of Engineering, University of Florida, David P. Arnold, Acting Director, Florida Semiconductor Institute, University of Florida, Matt Casto, Chief Technology Officer, Midwest Microelectronics Consortium
About the the Midwest Microelectronics Consortium (MMEC)
The Midwest Microelectronics Consortium (MMEC) leads the acceleration of microelectronic technologies and delivers solutions to establish a trusted and resilient domestic supply chain. The MMEC is the premier collaborative, public-private ecosystem that engages broadly across innovative partners in industry, academia, and government to rapidly advance defense and commercial applications. This unique environment empowers members to discover new technologies, share capabilities, develop a skilled workforce, and launch groundbreaking innovation into scalable commercial production for the benefit of National Security and economic dominance. www.mmeconsortium.org
About the NSF Engines: Central Florida Semiconductor Innovation Engine
Located in Osceola County, Florida, NeoCity serves as the site of one of the U.S. National Science Foundation’s (NSF) inaugural Regional Innovation Engines. Led by BRIDG—a not-for-profit, public-private partnership specializing in advanced system integration and packaging and focused on inclusive regional economic development—the Engine brings together major Central Florida research institutions, local government, nonprofits, and economic and workforce development partners to support the reshoring of the semiconductor advanced packaging industry. In addition to BRIDG, the Engine partners include CareerSource Central Florida, Florida High Tech Corridor, imec, the Orlando Economic Partnership, Osceola County, University of Central Florida, University of Florida, and Valencia College. NSF-2315320; www.GoBRIDG.com/NSFengine