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Advanced Packaging Technologies & Semiconductor Education

Taste of Tech Seminar Series


Talk 1: An exciting talk featuring Dale Miller, the Florida Vice President and General Manager at SkyWater Technology Foundry. He will highlight advanced packaging technologies, including Interposer, Hybrid Bonding, Fan-Out Wafer Level Packaging, and Prototype Assembly, developed at SkyWater’s Florida location.

Talk 2: An insightful talk featuring Dr. Gloria Kim, an Assistant Professor in the Dept. of Engineering Education at the University of Florida. Dr. Kim will provide an overview of her extramurally-funded work at the intersection of chips, education, and global partnerships.

Lunch will be provided during the seminar


11:45 AM – 1:00 PM

Physically Attending


Nanoscale Research Facility (NRF)

Room: 115

Virtually Attending




Lunch 11:45 – 12:00
Talk 112:00 – 12:20
Talk 212:20 – 12:40
Networking12:40 – 1:00